Technology Introduction

Our processing technique has been incorporated
into various components and technologies.

*Example of processing

小径孔加工 テキストイメージ
小径孔加工 イメージ画像

Technical features

  • High manufacturing yield
  • 0.06 mm - Micro hole drilling
  • Damageless processing

Example of technique

  • Hole diameter Φ0.06 × Depth 0.6 mm (Si)
  • Hole diameter Φ1.0 × Depth 50 mm (Al2O3)
  • Hole diameter Φ0.4 × Depth 30 mm (Si)
  • Hole diameter Φ0.5 × Depth 13 mm (SiC)

Fields of contribution

PC / スマホなど

Computer / smartphone

自動運転

Automatic driving

IOT

IOT

データセンター

Data center

*Example of processing

深孔加工 テキストイメージ
深孔加工 イメージ画像

Technical features

  • High accuracy: Hole straightness ≦0.1mm by Hole diameter Φ15 × Length 2,000mm processing
  • High aspect ratio: Length / Hole diameter = 450
  • Damageless processing

Example of technique

  • Synthetic quartz, outer diameter Φ40 - 170 × Length 300 - 1,000 mm
  • 1 - 100 spots: Hole drilling
  • Hole diameter Φ1.5 - 1.6: Through holes drilling
  • Inner wall mirror finish polishing

Fields of contribution

光ファイバー

Optical fiber for next-generation high capacity communication

*Example of processing

大型光学部品加工 テキストイメージ
大型光学部品加工 イメージ画像

Technical features

  • Super high value-added product: High yield
  • Lightweight processing: damageless processing
  • Processing range: Max. diameter 1,800 mm, Weight 3t

Example of application

  • Associate accessories of LCD manufacturing device
  • Components of aerospace related products
  • Components of large telescopes

Fields of contribution

航空宇宙関連

Aerospace industry

液晶製造装置部品

Components of LCD manufacturing equipment

大型望遠鏡(光学部品)

Large telescopes

(optical components)